DesignCon: SI, PI, EMI Have a Future Together

Brief

Santa Clara, Calif. — Our insatiable appetite for more data drives engineers to develop ever-faster links. Each speed increase brings with it a new set of engineering problems to solve. In the early 2000s, 1 Gbps was fast. Today, engineers are developing connections that will run at 112 Gbps. Some even have an eye on the next speed jump.

Each speed increase results in new issues in signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). No longer can engineers designing high-speed digital systems specialize in one discipline without some knowledge of the other two. With that in mind, five engineers presented their views on the future of SI/PI/EMI on Jan. 30, 2018, at DesignCon in a panel-based keynote address.

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